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AlSiC
Oxygen-free Copper Substrates
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AlSiC Flip-chip Lids and Microprocessor Lids
AlSiC IGBT Base Plate
AlSiC Hermetic Packaging
AlSiC Structural Parts
Oxygen-free Copper Package Lids
Oxygen-free Copper Substrates
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System level thermal design
Package level thermal design
Components and thermal design
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ADDRESS: No.9 Shiyang Road, Suzhou High-tech Park, Jiangsu Province, China
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