AlSiC Hermetic Packaging
Company

Flexural strength

Mpa

Yield strength

Mpa

Density

g/cm3)

Thermal Expansion

CTE ppm/℃)

Thermal Conductivity

(W/mK)

SITRI 393 241 3.00 7.35 233


The AlSiC hermetic packaging of the T/R module of GaAs millimeter wave microwave integrated circuit of airborne active phased array radar, while improving the performance, can reduce weight by 70%.
◆AlSiC has good air tightness to meet the needs of military packaging.
◆AlSiC has good heat dissipation and dimensional stability
◆The AlSiC microwave module can work well in strong vibration environment
◆The surface can be plated with nickel, gold, silver, copper with good plating performance.
Application: Compared with traditional packaging materials of metal or ceramic, AlSiC hermetic packaging has unparalleled performance advantages in the fields of power electronics, power microwave, photoelectric conversion, communication base station signal amplifiers, and hybrid circuits.

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