Density
（g/cm³）
Thermal expansion
（10-6/K）
Thermal conductivity
（W/m.K）
Melting point
Softening temperature
1083℃
150℃
8.93
17.6×10-6/K
401
OFC substrate has ultra-high thermal conductivity, which can be applied to various metal packaging. It is flexible in processing, easily shaped, and suitable for mass production.
Application: It can be integrated with components like hybrid integrated A/D or D/A converter; suitable for single-chip and multi-chip applications with low I/O count, suitable for radio frequency, microwave, optoelectronic, acoustic surface wave and high-power devices with high reliability.
