Oxygen-free Copper Package Lids
Density
（g/cm³）
Thermal expansion
（10-6/K）
Thermal conductivity
（W/m.K）
Melting point
Softening temperature
1083℃
150℃
8.93
17.6×10-6/K
401
It has advantages of high thermal conductivity, easy machining, and good compactness. The surface can be plated with nickel and gold with excellent welding performance.
