The System-level thermal solution is mainly about controlling the ambient temperature where the electronic equipment is located. The ambient temperature is an important boundary condition for the thermal analysis at the circuit board level.

There are three main thermal management designs.
1. Natural cooling: Electronic equipment generally adopts this cooling method. Thermal radiation can be propagated through a vacuum or through a gas with relatively little absorption. When there is a large temperature difference inside the electronic equipment, radiation heat exchange can be used for heat conduction.
2. Forced cooling: It includes air cooling and liquid cooling; air forced convection cooling technology reduces the volume of electronic equipment cooling system compared with natural cooling, making it have higher component density and higher hot spot temperature; liquid cooling mainly relies on the phase change principle. The phase change process is accompanied by the release and absorption of a large amount of heat. The phase change cooling can effectively control the temperature of electronic devices.
3. Heat pipe cooling: A heat pipe is a hollow tube with a sealed structure, which contains a liquid that transfers a large amount of heat when evaporating and a wick that brings the liquid back to the starting point when condensing. The whole process is completed without external power, without mechanical moving parts, without noise, and the design is extremely simple and effective, and the heat transfer is hundreds of times greater than that of solid metal.
Main designs: designs of metal electronic packaging housing, frame and base; designs of metal-ceramic composite electronic packaging housing, frame and base; designs of battery water-cooling plates; aerospace special VC structure heat dissipation design.